SPA Prealigner

• High alignment precision

• Fast alignment

• Direct control through the IDE ROB 320 Series robot

• Centroid or edge alignment for matching

• Small footprint

• High MTBF, low MTTR

• No adjustment required for multiple wafer sizes

• Built in diagnostics

• Better than Class 1 compatible (FED-STD-209)

• Lowest cost of ownership

• Custom configurations available

SPA 300 / Material Handling Modules / Technical Specifications

material	Si, GaAs, SaSi
cleanliness	better than Class 1 (FED-STD-209E)
communications	RS-232C
utilities:
vacuum	500 mm Hg (20" Hg)
power	24 VDC @ 1.2 Amps

Standard Models

Model	Wafer Size	Self-Correcting	Alignment Time (typical)	Repeatability Angular Orientation
SPA 100	2 in. - 4 in.	Self-Correcting	< 4 sec.	(±0.04°)	±25 µm
SPA 300	4 in. - 300 mm	Self-Correcting	< 4 sec.	(±0.04°)	±25 µm
SPA 300 HS	200 - 300 mm	Correction	< 2 sec.	(±0.08°)	±75 µm
		through robot offset
SPA 300 FC	4 in. - 300 mm	Self-Correcting	< 6 sec.	(±0.04°)	±25 µm
SPA 300 RA	- 230 mm square	Self-Correcting	< 10 sec.	(±0.04°)	±25 µm